Article
Why Most Chiplet Systems Fail After They Are Built
The Industry Assumption
Read post →Selected writing on DFM, UCIe, advanced packaging, yield learning, and architecture decisions that affect real chiplet schedules.
The Industry Assumption
Read post →Chiplet Summit 2026 · Technical Talk
Read post →In this podcast episode, we explore the fascinating journey of "chipletization" from its academic roots at Stanford University to becoming the...
Read post →How modular silicon became inevitable in the age of AI
Read post →At the recent Open Compute Project (OCP) Global Summit, the
Read post →As 2.5D systems bring GPUs, CPUs, HBM, and other chiplets closer together, thermal management stops being just a heatsink problem and becomes a...
Read post →🔥 The Industry Has Crossed a Line
Read post →This question comes quite often. When is a chip a chiplet? The team at the Chiplet Design Exchange (CDX) under the Open Compute Project (OC)...
Read post →The industry shift from monolithic chips to disaggregated chiplets, bound together through Heterogeneous Integration (HI), marks a significant...
Read post →IEEE2416 'Standard for Power Modeling to Enable System-Level Analysis' became official in May 2019. Among its many cool aspects it defines a new way...
Read post →The CDX (Chiplet Design eXchange) workstream under Open Compute Project’s ODSA sub-project is actively looking at the problems of chiplet...
Read post →If your team is evaluating chiplet partitioning, UCIe, test vehicles, or packaging tradeoffs, we can move from writing to working session quickly.