Engineering integrity first
We give direct assessments, including when chiplet or 3D-IC is the wrong answer for the program.
Chiplet.US is a US-based chiplet design and integration house specializing in 3D-IC architecture, DFM, IC design, and advanced heterogeneous packaging for teams that need a practical path from concept to manufacturable product.
The chiplet and 3D-IC transition is real, but most organizations do not have the internal stack of architecture, package, DFM, and validation expertise to navigate it cleanly. Too often, packaging constraints show up after the architecture is emotionally committed.
We integrate AI tools into DFM analysis, partition exploration, yield framing, and simulation setup to accelerate the engineering workflow without pretending the tooling replaces engineering judgment.
Chiplet.US was built to close that gap by combining architecture, DFM, IC design, and advanced packaging in one operating model.
From the first partition sketch to packaged, characterized silicon, the work needs to close across architecture, package, manufacturability, and validation.
Every inquiry is reviewed by a senior engineer, not a generic sales queue.
Whether you are evaluating heterogeneous integration for the first time or scaling an existing program, we can help structure the work so packaging and manufacturability are not left behind.