AI-Accelerated Chiplet Design by Chiplet.US

Designed for Yield.
Accelerated by AI.

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Chiplet.US helps teams move from architecture to package with fewer blind spots. We combine chiplet architecture, DFM, test vehicles, IC design, and advanced packaging so the package is treated as a first-order system constraint, not a late-stage detail.

Architecture + package co-planning
UCIe and custom D2D evaluation
AI-assisted DFM and yield analysis
Test vehicles before production risk
Architecture to Package
Integrated design chain from concept through assembly
AI-assisted Workflows
Faster DFM, partition exploration, and packaging review
2.5D and 3D-IC
Interposer, bridge, and stacked-die programs
Capabilities

Design and build for multi-die systems

A stage-gated process built for chiplet and 3D-IC programs where architecture, DFM, test vehicles, design, and packaging must close together.

01
Design for Manufacturability
Full-stack DFM for 2.5D and 3D-IC covering micro-bump pitch, RDL routing, thermal constraints, warpage risk, SI/PI simulations, and assembly yield modeling before masks are committed.
YieldThermalWarpage
02
Chiplet System Architecture
Die partition strategy across compute, memory, I/O, and analog domains so package cost, NRE, and PPA are evaluated together instead of in sequence.
PartitioningPPACost
03
Test Vehicle Services
STCO test vehicles and bring-up plans that qualify process, stack, and package assumptions before the main product program absorbs the risk.
STCOBring-upValidation
04
Advanced IC Packaging
2.5D interposers, 3D-IC stacking, fan-out, and embedded bridge packaging with substrate and assembly co-design for signal integrity and power delivery closure.
2.5D3D-ICCo-design
05
UCIe & Die-to-Die IP
Vendor-neutral IP selection, interoperability audits, package channel review, and D2D trade studies across standard and custom interfaces.
UCIeInteropChannel model
06
RTL-to-GDSII IC Design
Full custom and semi-custom chiplet implementation from RTL through physical sign-off, with die-to-die PHY integration and mixed-signal floorplanning.
RTLPhysicalMixed-signal
Process

From concept to production

The order matters. We move architecture, DFM, package, and validation decisions earlier so the product program is not forced to absorb preventable risk late.

01
Concept & Architecture
Die partition, 3D-IC feasibility, node selection, interface definition, and AI-assisted PPA exploration.
02
DFM & Package Co-design
Thermal, mechanical, and electrical co-design with AI-accelerated warpage prediction and yield modeling.
03
Test Vehicle & Bring-up
STCO test vehicle fabrication, characterization, yield learning, and process qualification before production.
04
RTL-to-GDSII Design
Chiplet IP design, PHY integration, physical implementation, and tape-out planning.
05
Production & Scale
Volume ramp support, manufacturing oversight, and ongoing yield improvement as programs move into deployment.
Applications

Markets we serve

Automotive & ADAS
Safety-rated chiplet SoCs for ADAS, sensor fusion, radar DSP, and automotive-grade memory in ISO 26262-aware heterogeneous packages.
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Defense & Aerospace
Trusted-foundry chiplet solutions for defense and space with design-chain traceability and mixed-criticality 3D-IC architecture.
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Medical & Edge AI
Ultra-low-power chiplet and 3D-IC designs for implantable and wearable devices where compute density must fit strict power budgets.
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High-Performance Computing
Chiplet and 3D-IC processor architectures for data center and HPC with best-node-per-function CPU, memory, and I/O partitioning.
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AI & ML Accelerators
Custom AI silicon combining compute, HBM via 3D-IC, and network chiplets optimized for inference and training density.
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Networking & Telecom
Switch and router ASICs combining SerDes, switching fabric, and management chiplets across optimized process nodes.
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Case Studies

Selected programs

Test Vehicle · Advanced Packaging
From Monolithic to Multi-Chiplet: HPC Processor Transformation
A semiconductor company needed to qualify STCO interposer technology at fine pitch before committing to a 4-chiplet HPC tape-out. Chiplet.US designed the test vehicle, daisy-chain structures, and SI channels used to derisk the program.
40µm pitch>94% yield6 weeks
Architecture · DFM · IC Design
AI Inference Accelerator: Monolithic-to-Chiplet Migration
A 650mm² monolithic accelerator hit yield and cost limits at 5nm. Full die-partition analysis and interposer DFM co-design produced a three-chiplet path with strong RTL reuse and lower NRE.
47% NRE reduction2.8× yield90% RTL reuse
Clients We Serve

Who we work with

We work with semiconductor companies, fabless houses, hyperscalers, defense primes, and automotive OEMs, from first chiplet exploration to multi-generation production programs.

Semiconductor companies developing chiplet-based processors
Fabless design houses exploring disaggregated architectures
Hyperscalers building custom silicon for data centers
AI and ML companies requiring specialized compute solutions
Automotive OEMs and Tier 1 suppliers
Defense and aerospace prime contractors
Telecommunications equipment manufacturers
Medical device and edge compute companies
News

Posts from the field

Technical updates, program lessons, and packaging insight from ongoing chiplet, 2.5D, and 3D-IC work.

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Faster results with
AI-accelerated design.

We combine chiplet engineering expertise with AI-assisted workflows for faster DFM analysis, better partition exploration, and fewer late-stage packaging surprises.

Contact Us →Schedule a Consultation →