Applications - Automotive & ADAS

Chiplet & 3D-IC Design for
Automotive & ADAS

Modern ADAS and autonomous driving systems demand compute density, functional safety, and automotive-grade reliability at the same time. Chiplet and 3D-IC architectures let you split safety, memory, and performance domains across the process nodes and package technologies that actually fit the job.

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ISO 26262
Functional safety-aware chiplet architecture
AEC-Q100
Qualification process support
2.5D + 3D
Heterogeneous integration for ADAS SoCs
DFM Audit
Yield and reliability from day one
The Challenge

Why automotive is driving the chiplet and 3D-IC transition

Functional safety at advanced nodes
ASIL-driven redundancy and diagnostic coverage are too expensive to keep duplicating on the most advanced process nodes. Chiplet partitioning lets safety and control logic live on mature nodes while compute stays on leading-edge silicon.
Sensor fusion bandwidth demands
Radar, lidar, vision, and sensor fusion workloads keep pushing memory bandwidth past what monolithic SoCs can deliver economically. 3D memory integration and chiplet partitioning relieve that pressure early in the architecture phase.
Long qualification cycles
Automotive schedules are punished hard by respins. DFM-first planning and STCO test vehicles reduce first-pass failure risk before qualification dollars get burned.
Chiplet.US Insight
The move to higher-voltage EV platforms and more autonomous driving functionality forces a silicon strategy change. Mixed-node chiplet systems are often the only practical route to combine advanced AI compute with proven automotive-qualified interfaces.
Our Approach
We treat functional safety as an input to die partitioning, interconnect planning, and package topology instead of treating it as compliance paperwork at the end.
Services for Automotive & ADAS

What Chiplet.US delivers for automotive programs

Safety-aware die partition analysis
Partition strategy that reflects ASIL decomposition, redundancy topology, and interface fault containment up front.
ASILPartitioningISO 26262
DFM audit and automotive reliability review
Thermal, warpage, assembly yield, and reliability review across the environmental range automotive programs actually face.
DFMThermalAEC-Q100
Advanced packaging for ADAS
2.5D and 3D-IC packaging for bandwidth-heavy compute with thermal co-design and assembly process selection suitable for automotive environments.
2.5D/3D-ICPackagingReliability
Qualification-oriented test vehicles
STCO vehicles and package test structures designed to reduce uncertainty before the production program takes on qualification risk.
STCOQualificationValidation
Channel model extraction
Signal and power integrity model extraction from package and layout data for the links that matter to the final system.
SI/PIModelsODB++
UCIe and D2D advisory
Vendor-neutral interface evaluation, interop planning, and package-channel review for multi-die connectivity.
UCIeInteropIP
Why Chiplet.US

What we bring to automotive chiplet programs

Safety built into architecture
We understand how safety decomposition maps into die boundaries, interface redundancy, and package-level fault containment.
Thermal expertise for harsh environments
Automotive deployment temperatures demand full-stack thermal co-design from junction through package and board assumptions.
Qualification-ready execution
DFM audit, test vehicles, and assembly yield modeling are used to protect schedule before qualification begins.
Manufacturing-agnostic execution
We work across foundry and OSAT options instead of forcing a single manufacturing path before the trade study is done.
Deliverables

What you receive from an automotive engagement

Architecture & DFM
  • ASIL-aware chiplet partition specification
  • Process-node recommendation by die
  • Automotive-focused DFM audit report
  • Thermal and warpage analysis
  • Reliability risk summary
Test & Validation
  • STCO test vehicle package
  • Qualification-oriented test structures
  • Assembly yield characterization plan
  • SI/PI results and models
  • Interface interoperability plan
Get Started
Ready to design your automotive chiplet SoC?

Whether you are evaluating chiplet architecture for a next-generation ADAS platform or preparing for qualification, we can engage quickly and with the right level of engineering detail.

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