Applications - High-Performance Computing

Chiplet & 3D-IC Design for
High-Performance Computing

HPC programs live at the intersection of performance, bandwidth, power, and cost. Chiplet systems are no longer optional when large dies, memory bandwidth demand, and advanced-node economics all collide.

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Bandwidth First
Memory and interconnect planned with compute
Best-Node Mix
CPU, memory, and I/O on the right nodes
2.5D + 3D
Interposer and stacked-memory options
DFM Audit
Large-program risk surfaced early
The Challenge

Why HPC programs are moving to chiplet architecture

Monolithic die economics break down
At the high end, die size and advanced-node mask cost make monolithic scaling ugly fast.
Memory bandwidth dominates system value
The compute roadmap is meaningless if the memory and package path cannot feed it.
Yield and NRE pressure compound
Large dies and advanced packaging both punish programs that treat manufacturability as an afterthought.
Chiplet.US Insight
The winning HPC architecture is often the one that acknowledges package, memory, and manufacturing economics early enough to shape the system design rather than merely decorate it.
Our Approach
We evaluate compute partitioning, memory integration, package channel limits, and manufacturing risk as one system problem.
Services for HPC

What Chiplet.US delivers for HPC programs

Partition and memory architecture review
Compute, cache, HBM, and I/O partition strategy analyzed together instead of in separate silos.
PartitioningHBMPPA
DFM and package audit
Yield, assembly, thermal, and package constraints analyzed before the cost model drifts into fiction.
DFMYieldPackage
Advanced packaging strategy
Interposer, bridge, and stacked-die choices matched to bandwidth and cost targets.
2.5D3D-ICHBM
STCO test vehicles
Vehicles that validate package, channel, and integration assumptions before the flagship program absorbs the risk.
STCOValidationLearning
Channel and SI modeling
SerDes, memory, and package-channel review grounded in extracted models rather than optimism.
SI/PIModelsSerDes
UCIe and D2D review
Interconnect planning and interoperability review for multi-die systems that need credible scaling paths.
UCIeInteropScaling
Why Chiplet.US

What we bring to HPC chiplet programs

Memory-package-compute co-planning
We do not separate bandwidth planning from architecture or package planning.
Economics-aware architecture
NRE and yield are treated as design constraints, not finance-team surprises.
Validation before flagship risk
Test vehicles and early packaging evidence keep the main program honest.
Real package discipline
Package channel limits and assembly assumptions are addressed before they become schedule slips.
Deliverables

What you receive from an HPC engagement

Architecture & Economics
  • Partition trade study
  • Memory integration plan
  • Cost and NRE framing
  • DFM review
  • Package-risk summary
Validation & Package
  • Test vehicle plan
  • SI/PI model package
  • Package architecture review
  • Interop review
  • Manufacturing options
Get Started
Ready to design your HPC chiplet architecture?

If your program is hitting monolithic limits on die size, bandwidth, or cost, we can help define a package-level architecture that is technically and economically defensible.

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