Applications - Defense & Aerospace

Chiplet & 3D-IC Design for
Defense & Aerospace

Defense and aerospace programs need supply-chain traceability, long lifecycle support, and mixed-criticality architecture choices that monolithic designs often make impractical. Chiplet systems let trusted and commercial technologies coexist with a clearer risk boundary.

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Trusted Foundry
Traceability-aware design chain support
Rad-Hard Aware
Mixed-criticality architecture guidance
2.5D + 3D
Integration for SWaP-C pressure
DFM Audit
Reliability and yield from first spin
The Challenge

Why defense programs are adopting chiplet and 3D-IC architecture

Supply chain security and traceability
Critical functions increasingly need traceable and trusted sourcing even when the performance roadmap depends on broader ecosystem silicon.
SWaP-C pressure
Airborne and space systems need more bandwidth and compute in smaller envelopes. Heterogeneous integration is often the only plausible path.
Radiation tolerance tradeoffs
Advanced nodes are not where you want every critical function to live. Chiplet partitioning gives you a credible mixed-node answer.
Chiplet.US Insight
Heterogeneous integration is strategically important because it decouples performance leadership from the requirement that every function be built on the most advanced or riskiest process option.
Our Approach
We support programs that need complete documentation, controlled workflows, and architecture decisions that stand up to procurement and program review.
Services for Defense & Aerospace

What Chiplet.US delivers for defense programs

Mixed-criticality partition analysis
Die partition strategy that separates security- or radiation-sensitive logic from commercial high-performance compute where needed.
TrustedRad-HardITAR
Reliability and DFM review
DFM audit with vibration, thermal, and packaging reliability concerns treated as program constraints rather than side checks.
DFMReliabilityMIL-STD
Advanced packaging for SWaP-C
Packaging strategy optimized for density, power, and footprint constraints in aerospace and defense platforms.
3D-ICSWaP-CPackaging
Defense-oriented test vehicles
STCO vehicles and validation planning that align with the qualification and documentation burden defense programs actually face.
STCOValidationTraceability
Channel model extraction
Package and interconnect model extraction for high-speed links that need more than rough assumptions.
ModelsSI/PILinks
D2D advisory and interop audit
Die-to-die interface evaluation with interoperability planning and documentation suitable for program review.
InteropIPDocumentation
Why Chiplet.US

What we bring to defense chiplet programs

Full design-chain traceability
Architecture, implementation, and package decisions are documented in a way procurement and oversight teams can actually use.
Mixed-criticality architecture expertise
We understand how to partition systems so trusted technology is used where it matters most without killing the overall performance plan.
SWaP-C driven package planning
Package and IC are co-designed to meet density and power targets together.
Manufacturing-agnostic execution
We work across ecosystem options and do not force a single manufacturing path before the program trade study is finished.
Deliverables

What you receive from a defense engagement

Architecture & Security
  • Mixed-criticality partition specification
  • Traceability-ready architecture package
  • Trusted-vs-commercial process strategy
  • DFM and reliability review
  • Program-risk summary
Validation & Packaging
  • Qualification-oriented test vehicle plan
  • Packaging co-design package
  • Interconnect and channel models
  • Interop review package
  • Manufacturing option trade study
Get Started
Ready to design your defense chiplet program?

Whether the program is radar, space compute, trusted-foundry integration, or mixed-criticality AI silicon, we can support the architecture and packaging decisions early enough to matter.

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